Signal Integrity/Power Integrity (SI/PI) Design Engineer

As the global leader in high-speed connectivity, Ciena builds the critical infrastructure powering the AI era. We’re a technology company shaping the future of networking, guided by innovation, integrity, and collaboration. Through development opportunities, meaningful work, and flexibility, Ciena supports growth and well-being—on and off the job. Connect with a career that matters. How You Will Contribute: As an SI/PI Design Engineer, you will be an integral part of the Ciena engineering team and lead the electrical package design for custom in-house photonic, analog, and digital ICs supporting next generation optical modules. - Simulate and optimize signal/power integrity and RF performance of the package design - Drive and support definition of advanced package selection, new product BGA configuration and package structure - Responsible for package/SIP layout, optimization, design verification and tapeout - Interface and coordinate with cross-functional groups throughout Ciena on new product package selection, feasibility analysis and design - Work cross-functionally, understand trade-offs, constraints, and optimizing silicon floor plan, bump and package pin out - Interface and work with CMs and vendors for the sourcing existing designs and future product development Must Haves: - Bachelors in Electrical Engineering or Physics - 2+ years hands on experience with IC package design - Fluent in SI/PI and EM simulation tools such as SIWave, HFSS - Thorough understanding of signal and power integrity fundamentals Assets: - Masters or PhD in Electrical Engineering or Physics - Substrate design experience for RF, digital, high speed and mixed signal die - Proficient in Advanced Package Designer (APD)+SIP and/or Xpedition Package Designer (XPD) tools (Cadence highly preferred) - Experience in package design electrical review, SI/PI analysis - Experience in package design for manufacturing reviews - Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers - Problem solver with strong engineering fundamentals Pay Range: The annual salary range for this position is $98,600 - $157,400. Pay ranges at Ciena are designed to accommodate variations in knowledge, skills, experience, market conditions, and locations, reflecting our diverse products, industries, and lines of business. Please note that the pay range information provided in this posting pertains specifically to the primary location, which is the top location listed in case multiple locations are available. Non-Sales employees may be eligible for a discretionary incentive bonus, while Sales employees may be eligible for a sales commission. In addition to competitive compensation, Ciena offers a comprehensive benefits package, including medical, dental, and vision plans, participation in 401(K) (USA) & DCPP (Canada) with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company-paid holidays, paid sick leave, and vacation time. We also comply with all applicable laws regarding Paid Family Leave and other leaves of absence. At Ciena, we are committed to building and fostering an environment in which our employees feel respected, valued, and heard. Ciena values the diversity of its workforce and respects its employees as individuals. We do not tolerate any form of discrimination. Ciena is an Equal Opportunity Employer, including disability and protected veteran status. If contacted in relation to a job opportunity, please advise Ciena of any accommodation measures you may require.