Про вакансію
At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.
Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.
Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.
We are actively seeking a Software Architect based in one of the following locations: India (Hyderabad/Bangalore), UK (Reading/Cambridge) Switzerland (Lausanne).
Responsibilities:
- Architect CMIS 5.x stack (DataPath State Machine, VDM, I2C/MCTP, FW-SW interface)
- Lead host interop tests for hyperscalers (Meta, AWS, etc.), build test matrix and regression suite
- Develop manufacturing test orchestration (ATE integration, yield analytics, on-chip stimulus)
- Build telemetry pipeline from FW to host/cloud (formats, compression, SDK APIs)
- Own customer SDK and tools (C/Python, CLI, log analysis), release management
- Ensure standards compliance (CMIS 5.x, OSFP MSA, SFF-8024, OIF)
- Travel: Up to 25% (customer engagement, manufacturing, standards)
Skills:
- Good knowledge of C/C++, Python, systems language (Go/Rust); CI/CD, conformance tests
- Good knowledge of I2C/MCTP, SFF-8024, vendor extensions
- Good understanding of standards implementation (OIF, SFF, IEEE mgmt-plane)
- Good knowledge of architecture documentation (SHALL/MUST, REQ traceability)
- Self-motivated, with strong sense of ownership and responsibility
- Good communication and reporting skills
Experience:
- Principal / Senior Staff (8-10 years post-degree)
- 8-10 years high-speed interconnect software (module SW, management, test, SDK)
- CMIS 4.x/5.x implementation and OSFP MSA experience
- Hyperscaler interop with NIC/switch ASICs (Nvidia, Broadcom)
- Test software architecture with ATE/yields
- Manufacturing and field support experience
Education:
- BS in Electrical Engineering, Computer Engineering, or Computer Science (MS preferred)
If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It!
https://www.kandou.ai/
Схожі вакансії, на які ми відгукнемося за вас
- Mechanical Forward Deployed Engineer - Switzerland
CoLab Software · Remote, CH · Розробник ПЗ · 100 CHF / Година
100 CHF / Година
Опубліковано 6 лист. 2026 р.
- Product Developer Off Price Intern
Guess Europe Sagl · Stabio, CH · Розробник ПЗ
Опубліковано 5 лист. 2026 р.
- CRM Application Engineer
lastminute.com · Hybrid, Chiasso, CH · Розробник ПЗ
Опубліковано 4 лист. 2026 р.
- Senior RAM Engineer
Destinus · Zürich, CH · Розробник ПЗ
Опубліковано 4 лист. 2026 р.